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AVerMedia Engineering Kit D315AO-1

  • SKU: MBS-AVM-35
  • GTIN: 05390368407180
  • HAN: D315AO-1
  • Category: Electronics
  • Manufacturers:

AVerMedia Engineering Kit D315AO-1

  • NVIDIA® Jetson AGX Orin™ (64 GB) in a fan-cooled compact enclosure
  • 120-pin MIPI SerDes (GMSL2/FPD-Link III) + 1x GbE and 1x 10GbE
  • 3x M.2 (4G/5G, Wi-Fi 6E, SSD), PCIe x8, CAN bus, 12–54 V DC

Description

AVerMedia Engineering Kit D315AO-1 with NVIDIA® Jetson AGX Orin™ Module

The AVerMedia Engineering Kit D315AO-1 is a ready-to-deploy edge AI system for autonomous machines, robotics and industrial vision. It combines the proven AVerMedia D315 carrier board with an NVIDIA® Jetson AGX Orin™ module (32 GB or 64 GB) or, alternatively, the AGX Orin™ Industrial module, together with active fan cooling in a compact enclosure. This puts the full compute performance of the AGX Orin platform at your disposal for complex AI models, sensor fusion and real-time video analytics directly on the robot or machine.

The 120-pin high-speed connector allows MIPI SerDes cameras (GMSL2, FPD-Link III, V-by-One HS) to be connected directly, as used in autonomous mobile robots (AMRs) for navigation and object detection. The 10 Gigabit Ethernet port doubles as the interface for 10GigE Vision industrial cameras, while an additional Gigabit port connects the system to the company network or further IP cameras. Three M.2 slots allow expansion with 4G/5G, Wi-Fi 6E and NVMe SSDs or capture cards, and a PCIe slot (x8 lanes) provides room for additional add-on cards.

With a wide DC input range of 12 to 54 V, an operating temperature range of -25 °C to +65 °C, CAN bus with transceiver and a 40-pin expansion header (UART, SPI, CAN, I2C, I2S, GPIO), the D315AO-1 is designed for use on mobile platforms and in industrial environments. An RTC battery with MCU monitoring and out-of-band support (power ON/OFF) complete the system. AVerMedia provides board support packages for current NVIDIA JetPack releases, so you can start developing right away with Ubuntu, ROS 2 and the NVIDIA AI stack.

Highlights

  • Compatible with NVIDIA® Jetson AGX Orin™ (64 GB)
  • 120-pin high-speed connector for MIPI SerDes cameras (GMSL2, FPD-Link III, V-by-One HS)
  • Dual Ethernet: 1x Gigabit RJ-45 and 1x 10 Gigabit RJ-45 (10GigE Vision)
  • Three M.2 slots: B-key (4G/5G), E-key (Wi-Fi 6E), M-key (SSD / capture card)
  • 1x PCIe slot (x8 lanes) for additional expansion cards
  • CAN bus with transceiver and 40-pin expansion header (UART, SPI, CAN, I2C, I2S, GPIO)
  • Wide DC input range 12–54 V, operating temperature -25 °C to +65 °C
  • Compact enclosure with active fan cooling, only 720 g
  • RTC battery with MCU monitoring and out-of-band support (power ON/OFF)

Applications

  • Autonomous mobile robots (AMR): Direct connection of multiple SerDes cameras for real-time perception, navigation and object detection
  • Smart inspection: Fast and accurate defect detection in quality control via 10GigE Vision industrial cameras
  • Smart security: AI-based video analytics of multiple IP cameras at the edge

Technical Specifications

Model AVerMedia D315AO-1 Engineering Kit (fan)
Supported modules NVIDIA® Jetson AGX Orin™ 64 GB
Carrier board AVerMedia D315
Cooling Active (fan)
Networking 1x Gigabit Ethernet RJ-45, 1x 10 Gigabit Ethernet RJ-45 (10GigE Vision)
Display 1x HDMI output
USB 2x USB 3.2 Type-A, 2x USB 2.0 Type-A, 1x USB 2.0 Micro-B (recovery)
Camera interface 1x 120-pin high-speed connector for MIPI SerDes (GMSL2 / FPD-Link III / V-by-One HS)
M.2 slots 1x B-key (4G/5G), 1x E-key (Wi-Fi 6E), 1x M-key (SSD / capture card)
PCIe 1x PCIe slot (x8 lanes)
CAN bus 1x CAN with transceiver
Expansion header 40-pin (UART, SPI, CAN, I2C, I2S, GPIO)
Storage 1x microSD card slot
SIM 1x micro SIM socket
Other RTC battery with MCU monitoring, out-of-band support (power ON/OFF)
Power input DC 12–54 V; DC jack max. 7 A, ATX 4-pin max. 10.8 A
Operating temperature -25 °C to +65 °C
Storage temperature -40 °C to +85 °C
Relative humidity 95 % at 40 °C (non-condensing)
Dimensions (W x L x H) 141.5 x 133.5 x 63 mm
Weight 720 g
Software AVerMedia BSP for NVIDIA JetPack 5.1.x, 6.x and 7.2 (Ubuntu / L4T)
Certifications CE, FCC, KC

Optional Accessories (sold separately)

  • Wi-Fi module M.2 E-key 2230 (Intel Wireless-AC 9260 or Intel Wi-Fi 6E AX210)
  • 4G LTE Cat4 module M.2 B-key 3042 (Quectel EM05-G)
  • 5G module M.2 B-key 3052 (Quectel RM520N-GL)
  • SSD M.2 M-key 2280, 256 GB
  • Capture cards M.2 M-key 2280 (SDI + HDMI, 2x SDI or 1x HDMI 4K)
  • GMSL2 camera STURDeCAM20

Scope of Delivery

  • 1x AVerMedia Engineering Kit D315AO-1 (D315 carrier board with NVIDIA® Jetson AGX Orin™ 64GB module, enclosure and fan cooling)
  • 1x Power adapter with power cord (EU)

NVIDIA, Jetson and AGX Orin are trademarks of NVIDIA Corporation. Images may differ from the actual scope of delivery.

Item information Value
Shipping weight: 1,40 kg
Item weight: 0,72 kg

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€ 5.759,95
incl. 19% VAT , plus shipping costs

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